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Intel Documents Point to AVX-512 Support for Cannon Lake Consumer CPUs

Thursday, October 19th, 2017 - CPUs, Teknologi

..._512 (3) kode remot multifungsi tv merk juc (2) ipress remot tv multisonic mtv-30 (1) joker tv-512 untuk tv tcl (1) kode remot joker goldsat summer (1) remot djoker (1)...

Western Digital Ships Client SSDs Based on 512 Gb 3D TLC NAND Chips

Saturday, May 20th, 2017 - SSDs, Teknologi

density standpoint, Western Digital’s 512 Gb 3D TLC NAND IC is a little bit behind Samsung’s 64-layer 512 Gb 3D TLC flash chip (which has a die size of 128.5...

Samsung Starts Production of 512 GB UFS NAND Flash Memory: 64-Layer V-NAND, 860 MB/s Reads

Wednesday, December 6th, 2017 - Storage, Teknologi

chips with 512 GB capacity based on its latest 64-layer 512 Gb V-NAND. The new UFS packages employ Samsung’s latest controller, which sport some performance improvements over its predecessors. The...

ADATA, PNY, and Team Group to Launch 512 GB microSDXC Cards This Summer

Saturday, June 9th, 2018 - Memory Cards, Teknologi

gearing up to start selling their 512 GB microSDXC cards next month. The products will offer similar performance-related specifications and will certainly not be cheap. However, with 512 GB microSDXC...

Integral Launches 512 GB microSDXC Card: UHC-I, U1, Class 10

Thursday, January 25th, 2018 - Memory Cards, Teknologi

Integral Launches 512 GB microSDXC Card: UHC-I, U1, Class 10 Integral Memory has released the industry’s highest-capacity microSDXC memory card that one can buy today. Integral’s new 512 GB microSDXC...

Toshiba Weds 3D NAND and TSV: Up to 1 TB 3D TLC Chips with 1066 MT/s I/O Incoming

Friday, July 14th, 2017 - SSDs, Teknologi

...GB and 1 TB 3D TLC NAND Chips   512 GB (4096 Gb) 1 TB (8192 Gb) Package NAND Dual x8 BGA-152 Base Die 512 Gb 48-Layer BiCS2 3D TLC...

Toshiba Samples 64-Layer 512 Gb BiCS 3D NAND, Announces 1 TB BGA SSD

Thursday, February 23rd, 2017 - SSDs, Teknologi

Toshiba Samples 64-Layer 512 Gb BiCS 3D NAND, Announces 1 TB BGA SSD Toshiba on Wednesday said that it had begun to sample its latest BiCS 3D NAND flash memory...