Intel to Launch Core i9-9900KS Next Month: 5 GHz on All Cores

Thursday, September 5th, 2019 - CPUs, Teknologi

Intel to Launch Core i9-9900KS Next Month: 5 GHz on All Cores At its pre-IFA press event, Intel confirmed that its new enthusiast-class Core i9-9900KS processor will launch in October. The CPU will be very similar to the Core i9-9900K introduced last year, but will...

Intel’s Next-Generation ‘Cascade Lake-X’ HEDT CPUs Due in October

Wednesday, September 4th, 2019 - CPUs, Teknologi

Intel’s Next-Generation ‘Cascade Lake-X’ HEDT CPUs Due in October Intel said Wednesday that its next-generation codenamed Cascade Lake-X processors for high-end desktops will be revealed next month. The company says that the new CPUs will provide a significant boost in performance per dollar when compared...

Intel’s LGA4189-4 and LGA4189-5 for Cooper Lake & Ice Lake CPUs Now Available

Monday, September 2nd, 2019 - CPUs, Teknologi

Intel’s LGA4189-4 and LGA4189-5 for Cooper Lake & Ice Lake CPUs Now Available TE Connectivity, a maker of various connectivity solutions, has introduced its newly-developed LGA4189 sockets for Intel’s next-generation Xeon Scalable processors supporting PCIe Gen 4. The products have been validated by Intel and...

AMD Bulldozer 'Core' Lawsuit: AMD Settles for $12.1m, Payouts for Some

Wednesday, August 28th, 2019 - CPUs, Teknologi

AMD Bulldozer 'Core' Lawsuit: AMD Settles for $12.1m, Payouts for Some AMD this month has agreed to pay compensation that totals $12.1 million to users who purchased FX-8000/9000 CPUs via its website or in the state of California. The case comes down to AMD advertising...

Intel Launches Comet Lake-U and Comet Lake-Y: Up To 6 Cores for Thin & Light Laptops

Wednesday, August 21st, 2019 - CPUs, Teknologi

Intel Launches Comet Lake-U and Comet Lake-Y: Up To 6 Cores for Thin & Light Laptops Capping off a busy few weeks for processors for Intel, today the company is announcing the second half of their product stack for their low-power 10th generation Core processors....

Hot Chips 31 Live Blogs: Intel Lakefield and Foveros

Wednesday, August 21st, 2019 - CPUs, Teknologi

Hot Chips 31 Live Blogs: Intel Lakefield and Foveros 07:14PM EDT – One of the interesting developments in packaging technology in recent memory is the 3D stacking of Intel’s new Foveros technology. The first chip to use this packaging technology is called Foveros, and today...

Hot Chips 31 Live Blogs: Intel/Tsinghua Xeon Jintide Security CPU

Wednesday, August 21st, 2019 - CPUs, Teknologi

Hot Chips 31 Live Blogs: Intel/Tsinghua Xeon Jintide Security CPU 07:47PM EDT – Doing custom x86 CPUs is nothing new: presenting one at Hot Chips is new. Here we have Tsinghua University giving a presentation on Jintide, its custom solution built upon Intel Xeon technology....