AMD: “No Chiplet APU Variant on Matisse, CPU TDP Range same as Ryzen-2000”

Friday, January 11th, 2019 - CPUs, Teknologi

AMD: “No Chiplet APU Variant on Matisse, CPU TDP Range same as Ryzen-2000” One of the big questions coming out of AMD’s CES announcements was if its new CPU design, codenamed Matisse and which enables two chiplets and an IO die on a single package,...

Intel’s Core i5-9400F Hits Amazon

Friday, January 11th, 2019 - CPUs, Teknologi

Intel’s Core i5-9400F Hits Amazon Amazon has started to list Intel’s six-core Core i5-9400F desktop processor that lacks integrated graphics, belongs to the Coffee Lake Refresh family, and is produced using the company’s 14 nm process technology. The CPU is aimed at mainstream PCs and...

More Intel 9th Gen Desktop CPUs: Core i7-9700, Core i3-9100, Pentium Gold G5420, and a new Core i3-8100F ?

Thursday, January 10th, 2019 - CPUs, Teknologi

More Intel 9th Gen Desktop CPUs: Core i7-9700, Core i3-9100, Pentium Gold G5420, and a new Core i3-8100F ? After yesterday when Intel casually mentioned that it was announcing six new processors in its 9th Generation desktop line, without providing any specifications through the usual...

The AMD Keynote at CES 2019: Looking Ahead

Thursday, January 10th, 2019 - CPUs, Teknologi

The AMD Keynote at CES 2019: Looking Ahead 11:34AM EST – AMD has one of the prized spots on the CES Keynote register. The company gets an highlighted hour at one of the shows prized ballroom setups to offer something bigger and better than any...

AMD Ryzen 3rd Gen 'Matisse' Coming Mid 2019: Eight Core Zen 2 with PCIe 4.0 on Desktop

Wednesday, January 9th, 2019 - CPUs, Teknologi

AMD Ryzen 3rd Gen 'Matisse' Coming Mid 2019: Eight Core Zen 2 with PCIe 4.0 on Desktop Blink and you miss it: AMD's keynote address this year was a whirlwind of primetime announcements for the company. The message is clear: AMD is committing itself to...

CES 2019 Quick Bytes: Intel’s 10nm Hybrid x86 Foveros Chip is Called Lakefield

Tuesday, January 8th, 2019 - CPUs, Teknologi

CES 2019 Quick Bytes: Intel’s 10nm Hybrid x86 Foveros Chip is Called Lakefield At Intel’s Architecture Day, the company showed off a new stacking technology called ‘Foveros’, which is designed to allows the company to make smaller chips. The idea behind Foveros is to have...

CES 2019 Quick Bytes: Consumer 10nm is Coming with Intel’s Ice Lake

Tuesday, January 8th, 2019 - CPUs, Teknologi

CES 2019 Quick Bytes: Consumer 10nm is Coming with Intel’s Ice Lake We’ve been on Intel's case for years to tell us when its 10nm parts are coming to the mass market. Technically Intel already shipped its first 10nm processor, Cannon Lake, but this was...