The G.Skill Royal Storage Box, Now On Sale: For All Your Royal Memories

Friday, April 12th, 2019 - Memory, Teknologi

The G.Skill Royal Storage Box, Now On Sale: For All Your Royal Memories Throughout the years we've seen the evolution of the Trident Z range from G.Skill which currently offers users with three different designs of DDR4 memory to choose from. This includes the standard...

Intel To Align 3rd Generation Optane DCPMM with DDR5: R&D in New Mexico

Wednesday, April 10th, 2019 - Memory, Teknologi

Intel To Align 3rd Generation Optane DCPMM with DDR5: R&D in New Mexico At Intel’s Data-Centric Innovation Day, Intel clarified with us where it sits in relation to its Optane DC Persistent Memory Strategy. While Intel made official launches for its new Cascade Lake Xeon...

Pricing of Intel’s Optane DC Persistent Memory Modules Leaks: From $6.57 Per GB

Friday, April 5th, 2019 - Memory, Teknologi

Pricing of Intel’s Optane DC Persistent Memory Modules Leaks: From $6.57 Per GB At least two retailers from the US on Friday have started to take pre-orders on Intel’s Optane DC Persistent Memory modules and therefore had to reveal their prices. Today they only offered...

Kingston Reveals DDR4-2933 Registered DIMMs for Cascade Lake-SP

Thursday, April 4th, 2019 - Memory, Teknologi

Kingston Reveals DDR4-2933 Registered DIMMs for Cascade Lake-SP Coinciding with the launch of Intel’s Xeon ‘Cascade Lake-SP’ platform, Kingston on Tuesday announced its new Server Premier registered DIMMs designed for the latest servers. The modules offer data transfer rates of up to 2933 MT/s and...

Samsung Develops Smaller DDR4 Dies Using 3rd Gen 10nm-Class Process Tech

Thursday, March 21st, 2019 - Memory, Teknologi

Samsung Develops Smaller DDR4 Dies Using 3rd Gen 10nm-Class Process Tech Samsung has completed development of its 3rd-generation 10 nm-class manufacturing process for DRAM as well as the first 8 Gb DDR4 chip that uses the technology. The 1z-nm process technology is said to be...

Samsung HBM2E ‘Flashbolt’ Memory for GPUs: 16 GB Per Stack, 3.2 Gbps

Thursday, March 21st, 2019 - Memory, Teknologi

Samsung HBM2E ‘Flashbolt’ Memory for GPUs: 16 GB Per Stack, 3.2 Gbps Samsung has introduced the industry’s first memory that correspond to the HBM2E specification. The company’s new Flashbolt memory stacks increase performance by 33% and offer double per-die as well as double per-package capacity. Samsung introduced...

Samsung Begins Mass Production of 12 GB LPDDR4X for Smartphones

Thursday, March 14th, 2019 - Memory, Teknologi

Samsung Begins Mass Production of 12 GB LPDDR4X for Smartphones Samsung announced late on Wednesday that it had started volume production of 12 GB LPDDR4X-4266 memory for high-end smartphones. The chip is currently the highest-density DRAM for mobile applications. The first smartphone to use Samsung’s 12...