Cadence DDR5 Update: Launching at 4800 MT/s, Over 12 DDR5 SoCs in Development

Saturday, March 28th, 2020 - Memory, Teknologi

Cadence DDR5 Update: Launching at 4800 MT/s, Over 12 DDR5 SoCs in Development JEDEC still has not published the DDR5 specification officially, yet it looks like DRAM makers and SoC designers are preparing for the DDR5 launch at full steam. Cadence, which was vocal about...

TeamGroup Announces 32GB T-Force Vulcan Z and Dark Z DDR4 Modules

Friday, March 27th, 2020 - Memory, Teknologi

TeamGroup Announces 32GB T-Force Vulcan Z and Dark Z DDR4 Modules One of the world's largest DRAM memory manufacturers TeamGroup has unveiled its first DDR4 memory kits featuring 32 GB sticks under its gaming-focused T-Force brand. The T-Force Vulcan Z and T-Force Dark Z will...

Rambus Develops HBM2E Controller & PHY: 3.2 Gbps, 1024-Bit Bus

Friday, March 6th, 2020 - Memory, Teknologi

Rambus Develops HBM2E Controller & PHY: 3.2 Gbps, 1024-Bit Bus The latest enhancements to the HBM2 standard will clearly be appreciated by developers of memory bandwidth-hungry ASICs, however in order to add support of HBM2E to their designs, they are also going to need an appropriate...

ATP’s DDR4-3200 Industrial DIMMs: Up to 128GB @ 1.2V for AMD & Intel

Thursday, March 5th, 2020 - Memory, Teknologi

ATP’s DDR4-3200 Industrial DIMMs: Up to 128GB @ 1.2V for AMD & Intel ATP has unveiled its latest memory modules for servers and industrial applications, boasting a 3200 MT/s data transfer rate, an industry-standard voltage, and capacities ranging from 2 GB to 128 GB. The...

SMART Modular Reveals 32 GB DDR4-3200 Low Profile Mini-DIMMs for Extreme Environments

Friday, February 14th, 2020 - Memory, Teknologi

SMART Modular Reveals 32 GB DDR4-3200 Low Profile Mini-DIMMs for Extreme Environments SMART Modular has unveiled a new lineup of 32 GB Mini-DIMMs for extreme environments, such as industrial or telecommunication applications. The new high-density modules come in ULP (Ultra Low Profile) as well as...

G.Skill Launches 256 GB DDR4-3600 CL16 Memory Kit

Wednesday, February 12th, 2020 - Memory, Teknologi

G.Skill Launches 256 GB DDR4-3600 CL16 Memory Kit The arrival of 32 GB unbuffered DIMMs has not only allowed mainstream systems to reach 128 GB of memory, but it's also allowed high-end desktops based on AMD Ryzen Threadripper or Intel Core i9 XE to reach...

SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM

Tuesday, February 11th, 2020 - Memory, Teknologi

SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM SK Hynix has inked a new broad patent and technology licensing agreement with Xperi Corp. Among other things, the company licensed the DBI Ultra 2.5D/3D interconnect technology developed by Invensas. The latter was...