Panasonic to Sell Semiconductor Business to Nuvoton

Friday, November 29th, 2019 - Semiconductors, Teknologi

Panasonic to Sell Semiconductor Business to Nuvoton Panasonic has announced plans to almost completely withdraw from semiconductor business and sell all of its related assets to Taiwan-based Nuvoton Technology, a wholly owned subsidiary of Winbond Electronics. Under the terms of the deal, Nuvoton will get...

SMIC Begins Volume Production of 14 nm FinFET Chips: China’s First FinFET Line

Thursday, November 14th, 2019 - Semiconductors, Teknologi

SMIC Begins Volume Production of 14 nm FinFET Chips: China’s First FinFET Line SMIC has started volume production of chips using its 14 nm FinFET manufacturing technology. The largest contract maker of semiconductors in China is the first company in the country to join the...

GlobalFoundries and SiFive to Design HBM2E Implementation on 12LP/12LP+

Tuesday, November 5th, 2019 - Semiconductors, Teknologi

GlobalFoundries and SiFive to Design HBM2E Implementation on 12LP/12LP+ GlobalFoundries and SiFive announced on Tuesday that they will be co-developing an implementation of HBM2E memory for GloFo's 12LP and 12LP+ FinFET process technologies. The IP package will enable SoC designers to quickly integrate HBM2E support...

Sony to Build New Fab to Boost CMOS Sensor Output

Friday, November 1st, 2019 - Semiconductors, Teknologi

Sony to Build New Fab to Boost CMOS Sensor Output Sony this week has revealed that the company will be building a new semiconductor fab to boost output of its CMOS sensors, as part of a broader effort to respond to growing demand for these...

GlobalFoundries and TSMC Sign Broad Cross-Licensing Agreement, Dismiss Lawsuits

Tuesday, October 29th, 2019 - Semiconductors, Teknologi

GlobalFoundries and TSMC Sign Broad Cross-Licensing Agreement, Dismiss Lawsuits GlobalFoundries and TSMC have announced this afternoon that they have signed a broad cross-licensing agreement, ending all of their ongoing legal disputes. Under the terms of the deal, the two companies will license each other's semiconductor-related...

TSMC: 5nm on Track for Q2 2020 HVM, Will Ramp Faster Than 7nm

Wednesday, October 23rd, 2019 - Semiconductors, Teknologi

TSMC: 5nm on Track for Q2 2020 HVM, Will Ramp Faster Than 7nm TSMC’s 5 nm (N5) manufacturing technology is projected to provide significant benefits when it comes to performance, power, and area scaling, which is why the contract maker of semiconductors expects a tangible...

New Tools Simplify Development of 2.5D Multi-Die 7nm Designs at Samsung Foundry

Tuesday, October 22nd, 2019 - Semiconductors, Teknologi

New Tools Simplify Development of 2.5D Multi-Die 7nm Designs at Samsung Foundry Advanced packaging technologies simplify production and increase performance of highly-complex multi-die SoCs as the semiconductor industry is looking at chiplet approach as an alternative to large dies that take a longer time long to...