Qualcomm Rejects Broadcom Offer to Buy the Company for $105 Billion

Monday, November 13th, 2017 - Semiconductors, Teknologi

Qualcomm Rejects Broadcom Offer to Buy the Company for $105 Billion Qualcomm has announced today that the Board of Directors has rejected Broadcom’s proposal to acquire the company for around $105 billion. The BOD believes that Broadcom’s offering undervalues Qualcomm and its growth perspectives in...

Broadcom Makes Unsolicited $105 Billion Bid for Qualcomm

Tuesday, November 7th, 2017 - Semiconductors, Teknologi

Broadcom Makes Unsolicited $105 Billion Bid for Qualcomm Broadcom on Monday said that it had proposed to acquire all of the outstanding shares of Qualcomm for $105 billion in total for cash and stock. If the buyout proceeds as planned, it will be the largest...

Samsung’s 8LPP Process Technology Qualified, Ready for Production

Thursday, October 19th, 2017 - Semiconductors, Teknologi

Samsung’s 8LPP Process Technology Qualified, Ready for Production Samsung this week announced that its 8LPP fabrication process, which it formally introduced earlier this year, had passed qualification tests. The manufacturing technology will be used to produce advanced SoCs next year and will be Samsung’s final...

Samsung Details 11LPP Process Technology: 10 nm BEOL Meets 14 nm Elements

Friday, September 29th, 2017 - Semiconductors, Teknologi

Samsung Details 11LPP Process Technology: 10 nm BEOL Meets 14 nm Elements Samsung has added a new manufacturing technology into its roadmap. The 11LPP fabrication process is designed for mainstream and higher-end smartphone SoCs. The technology will come online next year and will build upon...

GlobalFoundries Adds 12LP Process for Mainstream and Automotive Chips; AMD Planning 12LP CPUs & GPUs

Thursday, September 21st, 2017 - Semiconductors, Teknologi

GlobalFoundries Adds 12LP Process for Mainstream and Automotive Chips; AMD Planning 12LP CPUs & GPUs GlobalFoundries on Wednesday announced its new 12LP (leading performance) fabrication process. The new manufacturing technology was designed to increase transistor density and improve frequency potential compared to GlobalFoundries’ current-gen 14LPP...

TSMC Teams Up with ARM and Cadence to Build 7nm Data Center Test Chips in Q1 2018

Thursday, September 14th, 2017 - Semiconductors, Teknologi

TSMC Teams Up with ARM and Cadence to Build 7nm Data Center Test Chips in Q1 2018 TSMC has announced plans to build its first test chips for data center applications using its 7 nm fabrication technology. The chip will use compute cores from ARM,...

GlobalFoundries Details 7 nm Plans: Three Generations, 700 mm², HVM in 2018

Friday, June 23rd, 2017 - Semiconductors, Teknologi

GlobalFoundries Details 7 nm Plans: Three Generations, 700 mm², HVM in 2018 Keeping an eye on the ever-evolving world of silicon lithography, GlobalFoundries has recently disclosed additional details about its 7 nm generation of process technologies. As announced last September, the company is going to...