Western Digital Begins to Sample QLC BiCS4: 1.33 Tbit 96-Layer 3D NAND

Friday, July 20th, 2018 - Storage, Teknologi

Western Digital Begins to Sample QLC BiCS4: 1.33 Tbit 96-Layer 3D NAND Western Digital has started sampling its 96-layer 3D NAND chips featuring QLC architecture that stores four bits per cell. The chip happens to be the world’s highest-capacity 3D NAND device. The company expects...

Intel and Micron To Dissolve 3D XPoint Partnership After 2019

Tuesday, July 17th, 2018 - Storage, Teknologi

Intel and Micron To Dissolve 3D XPoint Partnership After 2019 A press release from Intel today has clarified the state of the 3D XPoint Joint Venture the company has with Micron. Currently Intel and Micron co-developed the new class of non-volatile memory, with manufacturing at...

A DIY Portable Thunderbolt 3 SSD with the TEKQ Rapide and SanDisk Extreme Pro

Tuesday, July 10th, 2018 - Storage, Teknologi

A DIY Portable Thunderbolt 3 SSD with the TEKQ Rapide and SanDisk Extreme Pro The emergence of NVMe SSDs in the compact M.2 form-factor, coupled with the rising popularity of Thunderbolt 3, has enabled a new class of portable high-performance flash storage devices. External SSDs...

Marvell Completes Acquisition of Cavium, Gets CPU, Networking & Security Assets

Monday, July 9th, 2018 - Storage, Teknologi

Marvell Completes Acquisition of Cavium, Gets CPU, Networking & Security Assets Marvell on Friday announced that it had completed its takeover of Cavium. The combined company will have a broad portfolio of IP and patents that promise to enable the combined company to grow as...

SilverStone Preps IP68 Water- and Dust- Proof Enclosure for 2.5-Inch Drives

Thursday, June 21st, 2018 - Storage, Teknologi

SilverStone Preps IP68 Water- and Dust- Proof Enclosure for 2.5-Inch Drives Rugged as well as water/dust-proof hardware usually comes in specially designed factory-sealed enclosures and is sold at a premium. SilverStone believes that if an enclosure is made right, it is good enough not only...