CRU Acquires ioSafe, Creating Disaster-Resistant Storage Powerhouse

Thursday, July 26th, 2018 - Storage, Teknologi

CRU Acquires ioSafe, Creating Disaster-Resistant Storage Powerhouse CRU last week took over ioSafe, creating a company that owns both software and hardware assets to create disaster-resistant storage solutions. Given their different specialties, CRU and ioSafe do not have products that compete directly against each other,...

Microsemi Announces SmartRAID Cards With On-Board Supercapacitors And Encryption

Thursday, July 26th, 2018 - Storage, Teknologi

Microsemi Announces SmartRAID Cards With On-Board Supercapacitors And Encryption Last year, Microsemi released a new generation of 12Gbps SAS controller chips, then incorporated them into a variety of SAS/SATA host bus adapter (HBA) and RAID cards under their Adaptec brand. Now, their SmartRAID family of...

Synology 2018 NAS and Wi-Fi Lineup Sneak Peek

Thursday, July 26th, 2018 - Storage, Teknologi

Synology 2018 NAS and Wi-Fi Lineup Sneak Peek Yesterday we published an interview with Alex Wang, CEO of Synology America, and as part of that interview we were able to get a sneak peak into some of the new NAS and Wi-Fi products that Synology...

Next-Gen NAS: An Interview with Alex Wang, CEO of Synology America

Tuesday, July 24th, 2018 - Storage, Teknologi

Next-Gen NAS: An Interview with Alex Wang, CEO of Synology America At AnandTech, we have been following the consumer and SMB NAS market very closely over the last decade. Synology is one of the leading vendors in this space. Similar to others in this market...

The Patriot Evlvr Portable Thunderbolt 3 1TB SSD Capsule Review

Monday, July 23rd, 2018 - Storage, Teknologi

The Patriot Evlvr Portable Thunderbolt 3 1TB SSD Capsule Review The rising popularity of Thunderbolt 3, coupled with the emergence of NVMe SSDs in the compact M.2 form-factor, has enabled a new class of portable high-performance flash storage devices. External SSDs with a Thunderbolt interface...

Western Digital Begins to Sample QLC BiCS4: 1.33 Tbit 96-Layer 3D NAND

Friday, July 20th, 2018 - Storage, Teknologi

Western Digital Begins to Sample QLC BiCS4: 1.33 Tbit 96-Layer 3D NAND Western Digital has started sampling its 96-layer 3D NAND chips featuring QLC architecture that stores four bits per cell. The chip happens to be the world’s highest-capacity 3D NAND device. The company expects...

Intel and Micron To Dissolve 3D XPoint Partnership After 2019

Tuesday, July 17th, 2018 - Storage, Teknologi

Intel and Micron To Dissolve 3D XPoint Partnership After 2019 A press release from Intel today has clarified the state of the 3D XPoint Joint Venture the company has with Micron. Currently Intel and Micron co-developed the new class of non-volatile memory, with manufacturing at...