Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon

Wednesday, August 21st, 2019 - Teknologi, VR

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon

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09:31PM EDT – DVFS per chip

09:31PM EDT – Reduced voltage, Vmin

09:31PM EDT – Most digital logic at 250 MHz, compute at 500 MHz

09:30PM EDT – Power gating, clock gating, removing ULV cells

09:29PM EDT – Now thermals

09:28PM EDT – But didn’t fit on the node. But adjusted a C model into RTL, for hardware. Reduces power to 1/3, and 1/30th latency

09:28PM EDT – Uses 3 sensors and applies filter

09:27PM EDT – JBL filter

09:27PM EDT – Hardened compute on ToF sensor

09:27PM EDT – instruction is applied to every pixel, saving 10k+ cycles per frame

09:27PM EDT – Example, boxavg_2x16x8 is a single cycle instruction

09:26PM EDT – Algorithm profiling to turn 10s of ops into a single instruction

09:25PM EDT – 100s of customized instructions

09:25PM EDT – >1 TOP of programmable compute

09:25PM EDT – 13 statically assigned compute cores

09:25PM EDT – New depth based algorithms

09:24PM EDT – DMA channel per core

09:24PM EDT – Trade off area for latency – low latency was key

09:24PM EDT – 2 Tensiilica processors per node

09:24PM EDT – FVP, Floating Vector Processor on bottom, does 3D

09:24PM EDT – Does 2D processing

09:24PM EDT – SIMD Fixed Point at top

09:24PM EDT – Balance between dedicated HW compute and flexibility / programmability

09:23PM EDT – Works with the software team to configure caches and memory

09:23PM EDT – Frees up the hardware

09:23PM EDT – No MMUs, simple interrupts

09:23PM EDT – Targets a single Microsoft RTOS

09:23PM EDT – HPU 2 is dedicated to only Microsoft workloads

09:22PM EDT – First prototype headset*

09:22PM EDT – First prototype

09:22PM EDT – 125 Mb of SRAM

09:22PM EDT – 2016 Tapeout

09:21PM EDT – 123M gates, 2B transistors

09:21PM EDT – 79mm2 on TSMC 16FF+

09:21PM EDT – Takes the visual cues and allows the HPU to track where the hands are at all times

09:20PM EDT – HPU works on specific workloads

09:20PM EDT – Application processor runs the app, and the HPU modifies the rendered image and sends to the display

09:19PM EDT – This speaker has been trained. There are purposeful pauses when she lists stuff

09:18PM EDT – Custom silicon, obviously

09:18PM EDT – Holographic processor

09:17PM EDT – HPU 2.0

09:17PM EDT – Here we go

09:03PM EDT – The final presentation of Hot Chips 31 is from Microsoft, who will be lifting the lid of the silicon behind its HoloLens 2.0 product.

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