Spotted: Qualcomm Snapdragon 8cx Wafer on 7nm

Thursday, December 6th, 2018 - SOC, Teknologi

Spotted: Qualcomm Snapdragon 8cx Wafer on 7nm

Alongside the announcement of the new 7nm Qualcomm Snapdragon 8cx processor for the company’s line of next generation premium tier Always Connected PCs, in the demo room today we saw a wafer of chips built on TSMC’s 7nm.


With this image, we can do one primary thing: work out the die size. Based on our estimates, we can see about 36 chips from top to bottom, and 22.2 chips from side to side. On a standard 300mm wafer, and give a little for the small amount of unused silicon from die to die so they can be cut up, we get a reasonable die size value of 112 square millimeters. This is what we expect to be the upper bound, and the final result may be lower.

That 112 mm2 is from a height of 8.3 mm and a width of 13.5 mm (which technically makes 112.05 mm2, but there is always margin for error here). This would make a total of 532 dies per wafer. There is no mention of defect rate or price per wafer in order to do an analysis of cost per die in manufacturing terms, but if ever get that information it would be an interesting metric.

In the slides, Qualcomm stated that the 8cx has double the transistors. We assume that’s a comparison to the Snapdragon 850, which is an overclocked S845, which had 5.3 billion transistors on the 10nm node. This would make the 8cx at around 10 billion transistors at 112 mm2, or the equivalent of 89 million transistors per square millimeter (89 mTr/mm2). The Snapdragon 845/850 on 10nm would have been 56 mTr/mm2.

Die Size and Transistor Counts
AnandTechProcess NodeDie Size
Die Area
Snapdragon 8cx7nm TSMC8.3 x 13.5112*10.0 b89.3
Snapdragon 845/85010LPP Samsung 945.3 b56.4
Snapdragon 83510LPE Samsung 72.33.0 b41.5
Kirin 9807nm TSMC 74.136.9 b93.1
Kirin 97010nm TSMC9.75 x 9.9296.725.5 b56.9
Kirin 96016nm TSMC10.77 x 10.93117.724.0 b34.0
Apple A12 Bionic7nm TSMC9.89 x 8.4283.276.9 b82.9
Exynos 981010LPP Samsung10.37 x 11.47118.94??
8-core Ryzen14nm GloFo22.06 x 9.661924.8 b25.0
Skylake 4+214nm Intel 13.31 x 9.191221.75 b14.3
*Upper Bound

More information as we get it.

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