Intel EOLs Atom Chip Used for Microsoft HoloLens

Thursday, August 10th, 2017 - Gadgets, Teknologi

Intel EOLs Atom Chip Used for Microsoft HoloLens Intel is retiring its Atom x5-Z8100P SoC that is used inside Microsoft’s HoloLens augmented reality headset. With the last units shipped in late October, it looks like the software giant is on track with its next-generation HoloLens...

TerraMaster D2-310 Storage Enclosure (2x 2.5"/3.5" SATA to USB 3.1 Gen 2 Type C) Mini-Review

Wednesday, July 5th, 2017 - Gadgets, Teknologi

TerraMaster D2-310 Storage Enclosure (2x 2.5"/3.5" SATA to USB 3.1 Gen 2 Type C) Mini-Review Storage bridges come in many varieties within the internal and external market segments. On the external side, they usually have one or more downstream SATA ports. The most popular uplink...

FLIR ONE Pro Thermal Camera Review

Tuesday, June 6th, 2017 - Gadgets, Teknologi

FLIR ONE Pro Thermal Camera Review ​We had written about the launch of the third-generation FLIR ONE along with the FLIR ONE Pro (and other professional thermal imagers) as part of our 2017 CES coverage. Today, FLIR is officially putting up the 3rd Gen. FLIR...